Chip-to-Atmosphere: Providing Safe and Effective Cooling
for High-Density, High-Performance Data Center
Environments
SessionSystem Cooling
Presenters
Event Type
Exhibitor Forum
TimeThursday, November 16th11am -
11:30am
Location503-504
DescriptionTo keep up with their customers' ever-increasing
demands, high-tech manufacturers are now introducing
high-performance processor chips and servers that
require liquid cooling. Liquid-cooled chips include the
Intel Xeon 150 chip (and the forthcoming Xeon 215W – 350
W), and the Nvidia GeForce GTX 1080 graphics card. As
companies demand more from their IT footprints, liquid
cooling in the data center is rapidly becoming a
necessity for high-density heat loads. But while the
transition from air cooling to liquid cooling may be
inevitable, it does not have to be exceptionally painful
for enterprise IT companies. In this presentation,
CoolIT and STULZ will look at the benefits of liquid
cooling. In particular, we'll highlight the
Chip-To-Atmosphere method as an example of an effective
cooling solution for high-capacity IT footprints.
